Public facility record
- Project state
- Unknown
- Location
- Suqian, China
- Location precision
- city-level
- Role
- Packaging, bumping, probe or test production base
- Site functions
- Assembly · Packaging · Test
- Products
- High-power device leadframe packaging · Test
- Processes
- Not disclosed in selected source
- Wafer sizes
- Not disclosed in selected source
- Public Scale
- Facility-level capacity is not disclosed in the selected source
- Production
- Official JCET ESG production-base disclosure
- Work
- Integrated-circuit packaging and test
Production, capacity, employment, exact coordinates and equipment totals are not inferred. Undisclosed values remain undisclosed.