Public facility record
- Project state
- R&D / pilot
- Location
- Chitose, Hokkaido, Japan
- Location precision
- official-address
- Role
- Advanced logic R&D and manufacturing hub
- Site functions
- R&D · Wafer fabrication
- Products
- Advanced logic
- Processes
- 2 nm-class
- Wafer sizes
- Not disclosed in selected source
- Public Scale
- Facility-level capacity is not disclosed in the selected source
- Production
- Official Rapidus IIM-1 facility record
- Work
- 2 nm-class process development and planned manufacturing
Public equipment disclosures
reported exact
1 reportedTWINSCAN NXE:3800E
ASML · Installed in December 2024
Count covers the specifically announced tool only.
Rapidus EUV installation announcement ↗Public relationships
Rapidus IIM-1 → ASML
One announced TWINSCAN NXE:3800E EUV system
Rapidus EUV installation announcement ↗Production, capacity, employment, exact coordinates and equipment totals are not inferred. Undisclosed values remain undisclosed.