VLSI MAP
Under construction / Advanced packaging / city-level

Indiana HBM Advanced Packaging Fab
West Lafayette, Indiana

SK hynix · Next-generation HBM advanced packaging, test and R&D project

Advanced packagingTestR&DHBM
Google Maps preview

The external map loads only after you request it.

Query-based Google Maps view. The selected result may not be a parcel-level facility coordinate; precision is recorded as city-level.

Public facility record

Project state
Under construction
Location
West Lafayette, Indiana, United States
Location precision
city-level
Role
Next-generation HBM advanced packaging, test and R&D project
Site functions
Advanced packaging · Test · R&D
Products
HBM
Processes
Not disclosed in selected source
Wafer sizes
Not disclosed in selected source
Public Scale
Over US$4 billion announced investment; cleanroom targeted for October 2028 and mass production for H2 2029
Production
Official SK hynix site or investment disclosure
Work
DRAM, NAND or backend manufacturing

Public relationships

Production, capacity, employment, exact coordinates and equipment totals are not inferred. Undisclosed values remain undisclosed.