Public facility record
- Project state
- Under construction
- Location
- West Lafayette, Indiana, United States
- Location precision
- city-level
- Role
- Next-generation HBM advanced packaging, test and R&D project
- Site functions
- Advanced packaging · Test · R&D
- Products
- HBM
- Processes
- Not disclosed in selected source
- Wafer sizes
- Not disclosed in selected source
- Public Scale
- Over US$4 billion announced investment; cleanroom targeted for October 2028 and mass production for H2 2029
- Production
- Official SK hynix site or investment disclosure
- Work
- DRAM, NAND or backend manufacturing
Public relationships
SK hynix Indiana HBM Fab → Purdue University
R&D collaboration and an advanced packaging testbed for next-generation packaging technology
SK hynix Indiana HBM fab groundbreaking ↗Production, capacity, employment, exact coordinates and equipment totals are not inferred. Undisclosed values remain undisclosed.