VLSI MAPFacilities,
with boundaries.
공식 기업·정부 공개자료에 연결된 시설과 프로젝트를 검색합니다. 주소·제품·공정·장비 수량은 출처가 공개한 정밀도까지만 표시합니다.
| Facility | Company | Location | Layer / State | Products / Processes | Evidence |
|---|---|---|---|---|---|
| Advanced Backend Fab 1 ↗Advanced backend manufacturing | TSMC | Hsinchu, Taiwan | Advanced packagingUnknown | Not disclosed in selected source | TSMC official fab directory ↗Retrieved 2026-08-28 |
| Advanced Backend Fab 2 ↗Advanced backend manufacturing | TSMC | Tainan, Taiwan | Advanced packagingUnknown | Not disclosed in selected source | TSMC official fab directory ↗Retrieved 2026-08-28 |
| Advanced Backend Fab 3 ↗Advanced backend manufacturing | TSMC | Longtan, Taoyuan, Taiwan | Advanced packagingUnknown | Not disclosed in selected source | TSMC official fab directory ↗Retrieved 2026-08-28 |
| Advanced Backend Fab 5 ↗Advanced backend manufacturing | TSMC | Taichung, Taiwan | Advanced packagingUnknown | Not disclosed in selected source | TSMC official fab directory ↗Retrieved 2026-08-28 |
| Advanced Backend Fab 6 ↗Advanced backend manufacturing | TSMC | Zhunan, Miaoli, Taiwan | Advanced packagingUnknown | Not disclosed in selected source | TSMC official fab directory ↗Retrieved 2026-08-28 |
| Rio Rancho Manufacturing Site ↗Advanced packaging and manufacturing site | Intel | Rio Rancho, New Mexico, United States | Advanced packagingUnknown | Not disclosed in selected source | Intel manufacturing fab locations ↗Retrieved 2026-08-28 |
| Indiana HBM Advanced Packaging Fab ↗Next-generation HBM advanced packaging, test and R&D project | SK hynix | West Lafayette, Indiana, United States | Advanced packagingUnder construction | HBM | SK hynix Indiana HBM fab groundbreaking ↗Retrieved 2026-08-28 |
| Amkor Arizona Advanced Packaging Campus ↗Semiconductor packaging and test factory | Amkor Technology | Peoria, Arizona, United States | OSAT / TestUnder construction | Advanced packaging · Test | Amkor Arizona groundbreaking announcement ↗Retrieved 2026-08-28 |